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  • 中国解决方案领导品牌
8层手戴式手机PCB设计

8层手戴式手机PCB设计


1、HDI  2+N+2

2、最小BGA PIN间距 0.5MM

3、最小线宽\间距 3.5MIL

4、最小6MIL过孔

5、板厚1.6MM

6、阻抗值 50 ohm  90 ohm 100 ohm

7、验收标准 IPC2